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Licence Professionnelle métiers de l'Électronique : Fabrication de cartes et sous-ensembles électroniques

Soutenu par l’Etat dans le cadre de l’AMI « Compétences et Métiers d’Avenir » du Programme France 2030, opéré par la Caisse des Dépôts.

Parcours : Production et Assemblage des SysTèmes ELectroniques (PASTEL)

Formation en alternance GRATUITE et RÉMUNÉRÉE

RNCP : 40304

Partner


General presentation


L’objectif de la Licence Professionnelle métiers de l’Électronique : Fabrication de cartes et sous-ensembles électroniques, parcours Production et Assemblage des SysTèmes ELectroniques (PASTEL) :  est de former des techniciens possédant une spécialité de base centrée sur l’électronique, l’informatique industrielle, aux métiers de l’industrialisation, du bureau des méthodes et des procédés dans l’industrie de l’assemblage et de la fabrication de systèmes électronique.


Job opportunities


Perspective d’emplois

Graduates of this professional degree work in R&D, design and methods, production and maintenance departments in a wide range of sectors: automotive, aeronautics, shipbuilding, home automation, consumer electronics, energy...

Cadre intermédiaire, il intervient en qualité d’assistant chef de projet, sous la responsabilité d’un ingénieur, dans :

Among other things, he or she can work as a process technician, manufacturer, process method, industrialization method or process project manager.

Further studies

L’objectif de la licence professionnelle est l’insertion professionnelle.
Une poursuite d’études est envisageable en Mastère 2 MLAI EISC «  Électronique, Industrialisation et Supply Chain « , proposé par le Campus GIP CEI de Redon, en fonction du dossier et du projet professionnel de l’étudiant.

Key figures

2025

de réussite*
0 %

2025

d'abandon
0 %

2025

de satisfaction
0 %

2024

for further study
0 %

2024

professional insertion
0 %

*Sur 9 répondants et 20 candidats présentés

 


Training objectives


Master the vocabulary and principles of different electronic board manufacturing technologies.

  • Carry out electronic studies and tests as part of the development and upgrading of components, sub-assemblies and electronic or electrical assemblies.
  • Set up and configure the vision system for product inspection
  • Specify design and manufacturing conditions, enabling the design office to design electronic boards or modules in the most cost-effective way.
  • Participate in the evaluation of the design from a manufacturing point of view at the various stages of industrialization.
  • Develop assembly processes for each new product, characterize optimal process conditions
  • Continuous process improvement from a productivity standpoint

Realize

Carry out electronic studies and tests as part of component development and upgrades

Set up

Set up and configure the vision system for product inspection

Specify

Specify design conditions

Evaluate

Participate in design evaluation from a manufacturing perspective

Characterize

Develop assembly processes for each new product, characterize optimal process conditions

Lead

Continuous process improvement from a productivity standpoint

Realize

Carry out electronic studies and tests as part of component development and upgrades

Set up

Set up and configure the vision system for product inspection

Specify

Specify design conditions

Evaluate

Participate in design evaluation from a manufacturing perspective

Characterize

Develop assembly processes for each new product, characterize optimal process conditions

Lead

Continuous process improvement from a productivity standpoint

Training program

Electrical empowerment, Basic electronics, C language programming, Automation

Thermal management for electronics (soldering, component technology), Metrology, Instrumentation, Sensors, Signal processing, Machine vision

Process qualification/SPC/Experience plan, Design office (gerber file, product documents, PCB blanking, Methods (case studies on line), Reliability/Inspection, Robotics/Automation/axis control

Surface mounting (screen printing, placement, reflow), Wave soldering: manual placement, double wave, selective soldering, Complement and manual soldering, Inspection (AOI, X-ray, visual inspection, testing), Troubleshooting

Technical reference systems and industrial standards, Company management, Project management, Quality systems, Optimization of electronic production processes and workstation design, Applied technical English, Communicating and convincing

In situ testing, functional testing (C language, labview), Schema analysis, Testability, Test coverage, FBGA programming, Boundary, Scan (Jtag)


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Rentrée : 07 septembre 2026

Date de jury de sélection : 20 avril, 11 mai 2026

Date limite de dépôts des dossiers : 30 mars, 03 mai 2026

Selection by application and interview.

  • Students with a BUT (ESE 2nd year course), BTS (SN and CIM courses) or L2 in electronics specialties.
  • Continuing education: employees or job-seekers.
  • Exceptions are possible on the basis of validation of professional experience (VAP 85), subject to a minimum of 3 years' professional experience.
  • Training also available through the VAE system.

Practical teaching, closely linked to the company, is provided by lecturers selected for their expertise.
Modules are assessed by continuous assessment + Writing and defending a dissertation on the work-study project + Writing and defending a dissertation on the tutored project.

501 heures sur 13 mois

La formation se déroule en alternance avec 15 semaines de formation en centre de formation et 40 semaines en entreprise sur un rythme de 4 à 5 semaines en entreprise / 3 à 4 semaines en centre de formation.

Training is provided by university lecturers, expert teachers and professionals.

Teaching takes place 30% at the IUT in Rennes and 70% at ESTI in Redon.

Les cours sont dispensés par des enseignants de l’université de Rennes et des intervenants professionnels. L’équipe pédagogique intègre 50 % d’industriels.

Training is based on the ESTI technology platform, and in part on the GEII department's robotics platform.
This technical platform is designed to serve :

  • to initiate and manage collaborative research and development projects involving research laboratories, companies, study centers, etc.
  • to carry out studies and feasibility tests as part of preliminary projects (process automation, prototyping, etc.).

Individualized monitoring of students under a double tutoring system: an educational tutor (at the training center) and an industrial tutor (at the host company).
2 follow-up visits by the educational tutor to the host company.

Frais de la formation : Formation en alternance
GRATUITE
et RÉMUNÉRÉE :

  • L’alternant signe un contrat de travail, lequel doit prévoir une rémunération.
  • Les frais de formation sont pris en charge par l’OPCO de l’entreprise d’accueil

Formation accessible aux personnes en situation de handicap

Contacter le Pôle vie Etudiant (PVE) : pve@univ-rennes.fr 02 23 23 36 29

Christine Lombard (Correspondante handicap pour les publics en formation continue et alternance) : christine.lombard@univ-rennes.fr


Companies
welcome
campus students


Training location

Plateforme électronique /ESTI Zone du Chatelet
6 rue de la Maillardais - 35600 REDON

IUT - University of Rennes 1

+33(0)2 99 71 60 24

Jamal RAMMAL

Jamal RAMMAL

Associate Professor and Director ESTI /GIP CEI

Mohamed HAOUARI

Deputy Director ESLI Redon / GIP CEI

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